Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

Product Description

Product Description

Specification

Type CPU radiator
Texture of material Copper base + copper fins
Heat dissipation method Air cooling
Power waste 95W

Packing & Delivery

Company Profile

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FAQ

What materials are used in this CPU radiator?
The radiator features a high-quality copper base and copper fins for optimal thermal conductivity.
What is the maximum TDP supported by this cooler?
This air cooling radiator is designed to handle a power waste (TDP) of up to 95W efficiently.
What type of cooling technology does it use?
It utilizes advanced air cooling technology combined with a high-performance copper fin structure for heat dissipation.
Is the installation process complex?
The design is optimized for standard hardware configurations, ensuring a straightforward and secure installation process.
Are the images of the product authentic?
Yes, all images provided are actual representations of the product and its packaging.
How is the product protected during shipping?
We use professional export-grade packaging to ensure the radiator and its fins remain undamaged during transit.

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