Manufacturer supplies AMD SP3 1U server with high-power CPU heat sink, copper bottom cooling chip, and uniform heating version
| Model |
TC009 |
| Type |
AMD heat sink |
| Texture of Material |
Copper aluminum bonding |
| Bearing Type |
Double ball bearings |
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
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Frequently Asked Questions
What CPU socket is this heat sink designed for?
This heat sink is specifically designed for the AMD SP3 socket, making it ideal for 1U server configurations.
What materials are used in the construction of the TC009?
The TC009 features a copper-aluminum bonding structure with a copper bottom to ensure superior thermal conductivity and uniform heat distribution.
What is the advantage of double ball bearings?
Double ball bearings offer a longer lifespan and higher reliability in high-temperature environments compared to standard sleeve bearings, perfect for 24/7 server operations.
Is this heat sink suitable for high-power processors?
Yes, it is specifically engineered as a high-power CPU heat sink with a uniform heating version to handle the demanding thermal loads of server-grade CPUs.
Can this be used in standard 1U rackmount cases?
Yes, its low-profile design is optimized for 1U server chassis where vertical space is limited but cooling performance is critical.
How are the products protected during shipping?
We use professional, environmentally friendly, and efficient packaging to ensure that the heat sinks reach you in perfect condition.
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