We leverage relationships with more than 1,150 supply partners, maintaining strategic stockpiles of major semiconductor components to protect clients against unexpected cost fluctuations and material shortages.
We source DRAM die components directly from major global wafer producers. Our memory modules utilize premium Samsung, SK Hynix, and Micron integrated circuits to ensure high compatibility and long operational lifespans.
High-density data environments require strict electrical signaling integrity. Our hardware designs employ multi-layer PCBs and optimized trace routing to reduce signal reflections and crosstalk, ensuring stable operation under heavy workloads.
From standard DDR4 8GB and 16GB solutions up to high-capacity 64GB desktop and server modules, configuring frequencies and timings to meet specific client benchmarks.
2. Firmware & SPD Customization:Writing custom SPD codes to match target system components, optimizing Intel XMP / AMD EXPO configuration parameters, and configuring tailored JEDEC settings.
3. Heatsink & PCB Engineering:Developing aluminum heat spreaders, applying high-performance thermal pads, and customizing PCB trace layouts for optimized heat dissipation.
4. Logo & Packaging Customization:Offering custom pad printing on PCBs, tailored thermal labels, blister packaging options, and design services for retail boxes.
Providing low-profile DIMM/SO-DIMM modules with operating temperatures designed for manufacturing equipment, automation lines, and outdoor computing terminals.
Delivering high-capacity solutions with ECC error correction to support cloud platforms, small-business storage servers, and virtualization environments.
Supporting custom computer brands, gaming systems, and office desktop builders with matched configurations to minimize system returns and support costs.
Our products carry certifications for CE, FCC, RoHS, and REACH, ensuring compliance with environmental standards in European, North American, and Asian markets. Furthermore, our raw materials undergo strict validation to conform to global lead-free initiatives.
Yes. Cynovex uses original chips sourced directly from Samsung, SK Hynix, and Micron. This ensures high compatibility, stable operational temperatures, and long-term durability for our finished products.
For standard bulk RAM orders, lead times are typically 7 to 10 working days. For custom OEM projects involving custom packaging, heatsinks, or unique SPD coding, production times range from 14 to 21 working days after sample confirmation.
Yes, we conduct comprehensive testing protocols, including functional, burn-in, system-level validation, compatibility, signal integrity, and aging tests. If necessary, we can also customize tests to replicate client-specific hardware platforms.
For standard unbranded modules, the MOQ is flexible. For OEM orders requesting customized silk-screening, custom packaging, or custom heatsinks, the typical MOQ starts at 500 units per configuration.
We offer functional testing validation and warranty support on all standard RAM modules. Our RMA team helps diagnose compatibility issues and provides direct replacement support for any defective products under standard operating conditions.
Cynovex
