Cynovex
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We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services.
Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
| Feature | Specification |
|---|---|
| Model | Aluminum substrate |
| Solder mask coverage | Resin plug hole |
| Outer copper thickness | 0.5oz |
| Forming method | Mold Forming |
| Category | Volume Production | Sample Processing | |
|---|---|---|---|
| Layer count | 1-68L | 64 Layer | |
| Max thickness | 10mm (394mil) | 14mm (551mil) | |
| Min line width/space | Inner | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer | 2.5/2.5mil | 2.2/2.2mil | |
| Max copper | 6Oz | 30Oz | |
| Hole Size | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm(4mil) | 0.050mm(2mil) | |
| Aspect Ratio | 25:1 | 35:1 | |
Lead-free/Halogen-free: EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF
High-speed/High-frequency: Megtron6, Megtron7, Ro3003, Ro4350B, Ro4835, CLTE, Genclad, RF35
Surface Finished: HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold/Soft Gold Plating
Special Technology: Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, Mixed RF PCB, Busbar PCB
Shipping Methods:
| Layer | Shortest Lead Time (Sample) | Standard Lead Time (Sample) | Mass Production |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10-12 layer | 4 days | 7 days | 14-16 days |
| 14-18 layer | 5-7 days | 8-10 days | 16-18 days |
| 20+ layer | To be negotiated | ||
